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Extreme ultraviolet lithography
prints features smaller

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than the wavelength of the light
itself: 13.5 nanometers.

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EUV never failed on the physics.

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This light is absorbed
by air and by glass.

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So, no lenses and no air.

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The whole machine runs in a vacuum,

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bouncing light off the
flattest mirrors ever made.

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40 molybdenum silicon layers, polished
by Zeiss to sub-nanometer smoothness.

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Each mirror keeps 70% of the light.

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Stack 10 and barely 2%
reaches the silicon wafer.

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And making the light at all
means firing a carbon dioxide

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laser at a falling droplet of molten tin.

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Twice! The first pulse flattens
the droplet into a pancake.

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The second vaporizes it
into a plasma that glows

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at 13.5 nanometers.

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50,000 droplets every second
after 20 years of research.

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One machine costs over
$150 million and weighs 180 tons,

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and it prints the chips inside your phone.

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That is why EUV was the hardest

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engineering problem
in semiconductor history.

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The bottleneck that nearly
stalled Moore's law.